By R. J. Cava (auth.), Prof. Dr. Yoshichika Bando, Dr. Hisao Yamauchi (eds.)
Read or Download Advances in Superconductivity V: Proceedings of the 5th International Symposium on Superconductivity (ISS ’92), November 16–19, 1992, Kobe PDF
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4b shows the presence of a small amount of Bi(2212) phase (-10%), indicating that the reaction was not complete in the measured sample. D) ABOUT THE Bi(2212) ~ Bi(2223) REACTION MECHANISM It is well accepted that the Bi(2212) phase formed during the calcination process at 800-820°C transforms inside the Ag sheath to Bi(2223) during the reaction heat treatment at 837-844°C, the reaction being assisted by the presence of liquid phases . We found recently  that this reaction undergoes an intermediate step, where the Bi(2212) phase dissolves a certain amount ofPb, which can be observed by EDX measurements.
Seedlings in the power engineering field, 10 which are the applications foreseen at the very beginning, have had to compete with established technology and few have so far become commercially viable. The advent of high temperature superconductivity (HTS) may hasten their growth and acceptance, as with all other potential applications. ~ . OUNI> 1 t " SCI£NTISTS f WAn It. 1 I - , 1 -0-11 1\ r:: / INrurs tECHNOLOC; IS TS \ FRotv1 OHleR SCieNCeS ANIJ ! / / TtO'N~LDC;I£S. / Fig. 2 A diagram of the current stage in the evolution of the science and technology of superconductivity and its applications.
Firstly, I believe existing applications such as NMR spectroscopy and MRI have a long way to grow. X-ray technology has been developing for 100 years and is still progressing. MRI is less than 15 years old. These techniques may also find applications outside their current markets. Secondly, the technology of refrigeration, both for LT8 and HT8 temperature ranges, is developing rapidly. It will become easier to have different sections of a large system working at different temperatures. The miniaturisation of refrigeration should hasten the use of discrete superconducting elements and make it easier to combine them with semiconductor components within a complete system.